Automatic output of full technical program of conference

Go to Global conference schedule List of Technical Sessions Technical program List of sessions by Authors

Day 1 - Monday 16 Apr 2007
09:00	Opening session
09:10	S 1 Keynote session: Industrial Trends
10:40	Coffee break
11:10	S 2 Keynote session: New Developments in modeling
12:30	Lunch
14:00	S 3 Prediction of Fracture Failure	S 4 Coupled Electro-Structural Problems	S 5 Thermal Behavior Modeling and Characterization
15:50	Coffee break
16:30	S 6 Characterization and Modeling of Drop Test	S 7 Microfluidics	S 8 Simulation in Packaging Design
18:00	End of day 1 technical sessions
19:30	Dinner

Day 2 - Tuesday 17 Apr 2007
08:30	S 9 Prediction of Dynamic Behavior	S 10 Model Order Reduction
09:40	Coffee break
10:00	S 11 Thermo-mechanical issues in microelectronics and MEMS	S 12 Multi-physics and thermal simulation and characterisation
11:00	S 13 Prediction of Fatigue Failure	S 14 Optimization based Design
12:40	Lunch
14:00	S 15 Characterization and Modeling of Polymer Behavior	S 16 Solder Joint Life Prediction
15:50	Coffee break
16:30	Special Exhibitors session
18:00	Cocktail party
20:00	S 17 AMICOM
21:30	End of day 2 technical sessions

Day 3 - Wednesday 18 Apr 2007
08:30	S 18 Keynote session: New Developments in Modeling and Experiments - 1
10:00	Coffee break
10:30	S 19 Characterisation and Modeling of Interface Strength	S 20 Materials in Micro and Nanotechnologies
12:20	Lunch
14:00	S 21 Keynote session: New Developments in Modeling and Experiments - 2
16:00	End of conference

Go to Global conference schedule List of Technical Sessions Technical program List of sessions by Authors

List of Technical Sessions
S-1 Keynote session: Industrial Trends
S-2 Keynote session: New Developments in modeling
S-3 Prediction of Fracture Failure
S-4 Coupled Electro-Structural Problems
S-5 Thermal Behavior Modeling and Characterization
S-6 Characterization and Modeling of Drop Test
S-7 Microfluidics
S-8 Simulation in Packaging Design
S-9 Prediction of Dynamic Behavior
S-10 Model Order Reduction
S-11 Thermo-mechanical issues in microelectronics and MEMS
S-12 Multi-physics and thermal simulation and characterisation
S-13 Prediction of Fatigue Failure
S-14 Optimization based Design
S-15 Characterization and Modeling of Polymer Behavior
S-16 Solder Joint Life Prediction
S-17 AMICOM
S-18 Keynote session: New Developments in Modeling and Experiments - 1
S-19 Characterisation and Modeling of Interface Strength
S-20 Materials in Micro and Nanotechnologies
S-21 Keynote session: New Developments in Modeling and Experiments - 2

Go to Global conference schedule List of Technical Sessions Technical program List of sessions by Authors

Session 1		09:10	Monday 16 Apr 2007
Keynote session: Industrial Trends A. Corigliano, Politecnico di Milano, Italy
09:10	30mn	Evolution of Semiconductor Packaging. Present and Future Carlo Cognetti, STMicroelectronics, Italy
09:40	30mn	Nanotechnology in Silicon CMOS Fabrication and Nanoelectronics Meyya Meyyappan, Center for Nanotechnology, NASA Ames Research Center, USA
10:10	30mn	Strategic Research Agenda of ?More than Moore? G.Q. (Kouchi) Zhang ¹, Mart Graef ², Fred van Roosmalen ² ¹ Philips Semiconductors, Eindhoven; Delft University of Technology, Delft, The Netherlands ² Philips Semiconductors, Eindhoven, The Netherlands

Session 2		11:10	Monday 16 Apr 2007
Keynote session: New Developments in modeling L. Ernst, Delft University of Technology, The Netherlands
11:10	30mn	Computational Challenges for Reliability Assessment of Next Generation Micro and Nano Systems Abhijit Dasgupta, University of Maryland, College Park, MD 20742, USA
11:40	30mn	Future of MEMS: An industry point of view Benedetto Vigna, STMicroelectronics / FTM ? MEMS Business Unit, Milano, Italy
12:10	30mn	Challenges in using nano-textured surfaces to reduce pressure drop through microchannels Tara Dalton ¹, Cormac Eason ¹, Ryan Enright ¹, Marc Hodes ², Paul Kolodner ², Tom Krupenkin ² ¹ Stokes Research Institute, University of Limerick, Ireland ² Bell Laboratories/Lucent Technologies Murray Hill, New Jersey, USA

Session 3		14:00	Monday 16 Apr 2007
Prediction of Fracture Failure R. Dudek, Fraunhofer Institute IZM, Germany; C. Bailey, Greenwich University, Great Britain
14:00	30mn	The Role of Simulation in Failure Prediction and Design Optimization in Electronics Packaging Andrew A. O. Tay, National University of Singapore, Singapore, Singapore
14:30	20mn	Efficient damage sensitivity analysis in advanced Cu low-k bond pad structures using Area Release Energy O. van der Sluis ¹, R.A.B. Engelen ¹, W.D. van Driel ², M.A.J. van Gils ², R.B.R. van Silfhout ¹ ¹ Philips Applied Technologies ² Philips Semiconductors
14:50	20mn	Non-Empirical Modeling of Fatigue in Lead-Free Solder Joints: Experimental Characterization and Estimation of Fracture Parameters Dhruv Bhate, Dennis Chan, Ganesh Subbarayan, Purdue University, West Lafayette, IN, USA
15:10	20mn	Measuring the strength of brittle microbeams without measuring forces or displacements. Arnon Hirshberg, David Elata, Technion - Israel Institute of Technology, Haifa, Israel
15:30	20mn	Prediction of high cycle fatigue in aluminum bond wires: A physics of failure approach combining experiments and multi physics simulations Jeroen Bielen, Jan-Joris Gommans, Frank Theunis, Philips Semiconductors, Nijmegen, The Netherlands

Session 4		14:00	Monday 16 Apr 2007
Coupled Electro-Structural Problems Dr. S. Marco, University of Barcelona, Spain
14:00	30mn	Design for Micro and Nano Manufacture ? The PATENT-DfMM Network of Excellence : Modelling and Simulation Cluster Andrew Richardson, Centre for Microsystems Engineering, Lancaster University, UK Orla Slattery, Tyndall National Institute, Cork, Ireland Marta Rencz, Budapest University of Technology and Economics, Hungary
14:30	20mn	MODELLING EFFECTS OF PACKAGING ON PULL-IN BEHAVIOUR OF DOUBLY ANCHORED BEAMS Maryna Lishchynska ¹, Conor O'Mahony ¹, Orla Slattery ¹, Olaf Wittler ² ¹ Tyndall National institute ² Fraunhofer Institut Zuverl?ssigkeit und Mikrointegration
14:50	20mn	On the Advantages of Using a Strong Coupling Variational Formulation to Model Electro-Mechanical Problem V?ronique Rochus ¹, Daniel J. Rixen ², Jean-Claude Golinval ¹ ¹ University of Li?ge, Li?ge, Belgium ² T.U. Delft, Delft, The Netherlands
15:10	20mn	Topology optimization of electromechanical microsystems against pull-in voltage Etienne Lemaire, Pierre Duysinx, V?ronique Rochus, Jean-Claude Golinval, University of Li?ge, Department of Mechanics and Aerospace
15:30	20mn	Using electromechanical buckling for measuring residual stress Samy Abu-Salih, David Elata, Technion - Israel Institute of Technology, Haifa, Israel

Session 5		14:00	Monday 16 Apr 2007
Thermal Behavior Modeling and Characterization Peter Rodgers, The petroleum Institue, UAE; Miquel Vellvehi, Centre Nacional de Microelectr?nica, Spain
14:00	30mn	Difficulties on the estimation of the thermal structure function from noisy thermal impedance transients Marc Salleras ¹, Jordi Palac ², Guillem Carles ¹, Santiago Marco ¹ ¹ University of Barcelona, Barcelona, Spain ² University of Lleida, Lleida, Spain
14:30	20mn	Comparison Between Simulated and Experimental Thermal Resistances of Power Devices Using an Specific Test Chip Xavier JORDA, Miquel VELLVEHI, Francesc MADRID, Jose Luis GALVEZ, Philippe GODIGNON, Jose MILLAN, Centre Nacional de Microelectr?nica - CSIC, Spain
14:50	20mn	EXPERIMENTAL INVESTIGATION ON THE LEAKAGE REVERSE CURRENT COMPONENT FLOWING AT THE SEMICONDUCTOR PN JUNCTION PERIPHERY Vasile V.N. Obreja, Cecilia Codreanu, National R&D Institute for Microtechnology (IMT ), Bucharest, Romania
15:10	20mn	Steady State and Transient Thermal Characterization for Flip Chip Interconnection on Flexible Substrate Liu Caroline Chen ¹, Reijo Lehtiniemi ², Bart Vandevelde ¹, Ali Arslan ² ¹ IMEC, Kapeldreef 75, B-3001 Leuven, Belgium ² Nokia Research Center, P.O. Box 407, FI-00045 Nokia Group, Finland
15:30	20mn	Electro-thermal simulation of DC/DC converter using a relaxation method Miquel Vellvehi, Xavier Jord, Philippe Godignon, Jos? Mill, Centre Nacional de Microelectr?nica (CNM-CSIC), Bellaterra (Barcelona), Spain

Session 6		16:30	Monday 16 Apr 2007
Characterization and Modeling of Drop Test T. Reinikainen, Nokia, Finland; B. Schwarz, Siemens, Germany
16:30	30mn	Analytical and Numerical Analysis of Drop Impact Behavior for a Portable Electronic Device Jiang Zhou, Kallolimath Sharan, Sachin Lahoti, Lamar University, Beaumont TX, USA
17:00	20mn	Lead-Free Solder Cyclic Plasticity Characterization for Drop Test Simulations Etienne Bonnaud, Infineon Technologies, Stockholm, Sweden; Royal Institute of Technology, Stocholm, Sweden Peter Gudmundson, Royal Institute of Technology, Stocholm, Sweden
17:20	20mn	Drop Simulation and Stress Analysis of MEMS Devices Torsten Hauck ¹, Gary Li ¹, Andrew McNeill ¹, Heiko Knoll ², Matthias Ebert ², J?rg Bagdahn ² ¹ Freescale Semiconductor ² Fraunhofer Institute for Mechanics of Materials
17:40	20mn	Impact Force Characteristics of Package-level Solder Joints Subjected to Ball Impact Test Chang-Lin Yeh, Yi-Shao Lai, Advanced Semiconductor Engineering, Inc., Nantze, Kaohsiung, Taiwan

Session 7		16:30	Monday 16 Apr 2007
Microfluidics Prof. G. Wachutka, TU Munich, Germany; Dr. Mario Gonzalez, IMEC, Belgium
16:30	20mn	Multi-Physics Modeling and Finite Element Approximation of Charge Flow in Ionic Channels Bice Chini, CNR Institute of Neuroscience Cellular and Molecular Pharmacology Section, Milan, Italy Joseph W. Jerome, Department of Mathematics, Northwestern University, Evanston, USA Riccardo Sacco, Politecnico di Milano, Dipartimento di Matematica, Milan, Italy
16:50	20mn	Modelling new design of fluidic microvalves Anna Pandolfi, Dipartimento di Ingegneria Strutturale, Politecnico di Milano, Italy Michael Ortiz, Graduate Aeronautical Laboratories, California Institute of Technology, Pasadena, CA, USA
17:10	20mn	ON THE APPPLICATION OF THE BGK MODEL TO THE SIMULATION OF FLUID STRUCTURE INTERACTION IN MEMS Cercignani Carlo, Frangi Attilio, Frezzotti Aldo, Lorenzani Silvia, Politecnico di Milano, Italy

Session 8		16:30	Monday 16 Apr 2007
Simulation in Packaging Design D. Andersson, IVF, Sweden; Abhijit Dasgupta, University of Maryland, USA
16:30	30mn	Thermo-mechanical Design of Resilient Contact Systems for Wafer Level Packaging Rainer Dudek ¹, Hans Walter ¹, Ralf D?ring ¹, Bernd Michel ¹, Thorsten Meyer ², Joerg Zapf ³, Harry Hedler ² ¹ Fraunhofer IZM, Micro Materials Center Berlin and Chemnitz, Germany ² Infineon Technologies AG, Germany ³ Siemens AG, Germany
17:00	20mn	Simulation and Analysis for Typical Package Assembly Manufacture Process Yong Liu ¹, Qiuxiao Qian ², Scott Irving ¹, Don Desbiens ¹, Timwah Luk ¹ ¹ Fairchild Semiconductor Corp., South Portland, ME, USA ² Fairchild Semiconductor, Suzhou, Jiangsu, China
17:20	20mn	Virtual Design and Qualification of IC Backend Structures R.B.R. van Silfhout ¹, O. van der Sluis ¹, W.D. van Driel ², J.H.J. Janssen ³, G.Q. Zhang ⁴ ¹ Philips Applied Technologies, Eindhoven, The Netherlands ² Philips Semiconductors, Nijmegen, The Netherlands ³ Philips CFT, Eindhoven, The Netherlands ⁴ Philips Semiconductors, Eindhoven, The Netherlands
17:40	20mn	Thermo-Mechanical Analysis of the Packaging Process for Micro-Electronic Displays Y Lee ¹, C Bailey ¹, H Lu ¹, S Riches ², M Bartholomew ², N Tebbit ² ¹ University of Greenwich. London,. United Kingdom ² MCE, Newmarket, United Kingdom

Session 9		08:30	Tuesday 17 Apr 2007
Prediction of Dynamic Behavior J. Zhou, Lamar University, USA. A. Dasgupta, CALCE, USA
08:30	30mn	Simulation of impact rupture in polysilicon MEMS Alberto Corigliano ¹, Fabrizio Cacchione ¹, Attilio Frangi ¹, Sarah Zerbini ² ¹ Politecnico di Milano ² STMicroelectronics
09:00	20mn	Numerical identification of geometric parameters from dynamic measurement of grinded membranes on wafer level Matthias Ebert ¹, Ronny Gerbach ¹, J?rg Bagdahn ¹, Steffen Michael ², Siegfried Hering ³ ¹ Fraunhofer Institute for Mechanics of Materials, Halle/ Saale, Germany ² Melexis GmbH, Erfurt, Germany ³ X-FAB Semiconductor Foundries AG, Erfurt, Germany
09:20	20mn	Assembly-Induced Stress and Its Effect on the Integrity of Assembly System in Drop Simulation Wei Ren, Jianjun Wang, Nokia

Session 10		08:30	Tuesday 17 Apr 2007
Model Order Reduction Pr. Andrew Tay, National University of Singapore; Pr. David Elata, Technion, Israel
08:30	30mn	Truly Nonlinear Model-Order Reduction Techniques Slobodan Mijalkovic, Delft University of Technology, Delft, The Netherlands
09:00	20mn	Parametric Finite Element Analysis for Reduced Order Modeling of MEMS Vladimir Kolchuzhin ¹, Jan E. Mehner ², Thomas Gessner ², Wolfram Doetzel ¹ ¹ Chemnitz University of Technology, Chemnitz, Germany ² Fraunhofer Institute for Reliability and Microintegration, Chemnitz, Germany
09:20	20mn	EFFICIENT PRE-STRESSED HARMONIC ANALYSIS OF RF-MICRORESONATOR BY MEANS OF MODEL ORDER REDUCTION L. Del Tin ¹, R. Gaddi ¹, A.Gnudi ¹, E. Rudnyi ², A. Greiner ², J. G. Korvink ² ¹ ARCES-DEIS, University of Bologna ² IMTEK, Laboratory for simulation, University of Freiburg

Session 11	10:00	Tuesday 17 Apr 2007
Thermo-mechanical issues in microelectronics and MEMS Marcel Meuwissen, TNO Science and Industry, Eindhoven, The Netherlands
	An Efficient Method for Assessing Board Level Reliability for Micro-electronic Packages using Combined Experimental ? Numerical Techniques M.Y. Jansen ¹, J.W.C. de Vries ¹, W.D. van Driel ² ¹ Philips Applied Technologies ² Philips Semiconductors and Delft University of Technology
	Thermal cycle reliability of the 3D chip stacked package using Pb-free solder bumps: Parameter study by FEM analysis Chikage Noritake ¹, Paresh Limaye ², Mario Gonzalez ², Bart Vandevelde ² ¹ DENSO CORPORATION, Japan & IMEC, Belgium ² IMEC, Belgium
	Lifetime Prediction of SnPb and SnAgCu Solder Joints of Chips on Copper Substrate Based on Crack Propagation FE-Analysis Sylvain D?planque ¹, Wolfgang N?chter ¹, Bernhard Wunderle ², Ralph Schacht ², Bernd Michel ² ¹ Robert Bosch GmbH, Stuttgart, Germany ² Fraunhofer IZM, Berlin, Germany
	Mechanical characterization analysis of a segmented silicon layer on ultra-thin polyimide substrates L. Wang, K.M.B. Jansen, M. Bartek, A. Polyakov, L.J. Ernst, Delft University of Technology
	Thermo-Mechanical Modeling of Plastic-Core Solder Balls in Ceramic Ball Grid Array Packages Jussi Anttonen ¹, Tero Kangasvieri ¹, Olli Nousiainen ², Jussi Putaala ¹, Jouko V?h?kangas ¹ ¹ Microelectronics and Materials Physics Laboratories, University of Oulu Finland ² Materials Engineering Laboratory, University of Oulu Finland
	Sequentially-Coupled Finite Element Transient Analysis with Hygroscopic Swelling Jiang Zhou, Lamar University, Beaumont TX, USA
	Automated Modeling and Fatigue Analysis of Flexible Printed Circuits Alexander Ptchelintsev, Nokia Research Center, Helsinki, Finland
	Modelling of Air Damping in MEMS Inertial Sensors: Comparison Between Numerical and Experimental Results Braghin Francesco, Leo Elisabetta, Resta Ferruccio, Politecnico di Milano
	Extraction of material parameters for creep experiments on real solder-joints by FE analysis Mike R?llig, Steffen Wiese, Klaus-J?rgen Wolter, Dresden University of Technology, IAVT
	Design and Analysis of a novel fan-out WLCSP structure Cadmus Yuan ¹, G. Q. Zhang ¹, Ching-Shun Huang ², Chun-Hui Yu ², Chin-Cheng Yang ², Wen-Kung Yang ², Ming-Chih Yew ³, C. Y. Chou ³, Kou-Ning Chiang ³ ¹ Department of Precision and Microsystem Engineering, Delft University of Technology, The Netherlands ² Advanced Chip Engineering Technology Inc., Taiwan ³ Department of Power Mechanical Engineering, National Tsing Hua University
	Numerical approach to investigation of thermally conductive adhesives Tomasz Falat ¹, Artur Wymyslowski ¹, Jana Kolbe ², Kaspar M.B. Jansen ³, Leo Ernst ³ ¹ Wroclaw University of Technology ² IFAM - Fraunhofer Institut fuer Fertigungstechnik und Angewandte Material ³ Delft Univeristy of Technology
	Modelling the stiffness and inertial characteristics of MEMS supporting beams: comparison between numerical and experimental results Francesco Bragin, Elisabetta Leo, Ferrucio Resta, Politecnico di Milano, Italy
	Reliability Optimization of Stacked System-in-Package Using FEA Jani Valtanen, Pekka Heino, Tampere University of Technology, Tampere, Finland
	Impact of Pitch Reduction over Residual Strain of Flip Chip Solder Bump After Reflow C. Davoine ¹, M. Fendler ², R. Fortunier ¹, C. Louis ¹ ¹ CEA/LETI Grenoble, France ² Centre de Micro?lectronique de Provence, France
	Complete elastic characterization of a silica layer by Brillouin scattering. G. Signoriello ¹, M.G. Beghi ¹, A. Rusconi Clerici ², G. Spinola ² ¹ Politecnico di Milano, Italy ² ST Microelectronics, Italy
	Reliability Impact of Highly Temperature-Dependent Underfill Material to the Lead-Free Flip Chip Package C. C. Chiu ¹, C. J. Wu ¹, C. Y. Chou ¹, C. T. Peng ¹, K. N. Chiang ¹, Terry Ku ², Kenny Cheng ² ¹ Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan ² VIA Technologies, Inc.,Hsin-Tien, Taipei, Taiwan
	Influence of the Thickness of Silicon Dies on Strength Stephan Sch?nfelder, Matthias Ebert, J?rg Bagdahn, Fraunhofer Institute for Mechanics of Materials, Halle, Germany
	Measurements of the solders surface tension values. Jan Urb?nek, Karel Du?ek, Czech Technical University in Prague, Czech Republic
	Thermomechanical stressing of solar cells Lubo? Jakubka, Pavel Cejtchaml, Ivan Szendiuch, Department of Microelectronics, Brno University of Technology
	Design for Reliability of Wafer Level Packages W.D. van Driel ¹, H.P. Hochstenbach ², G.Q. Zhang ¹ ¹ Philips Semiconductors, Delft University of Technology ² Philips Semiconductors
	Effects of aeronautical conditions on passivation cracking of micro-structures of IC packages Y.T. He ¹, H.P. Li ¹, F. Li ¹, L.Wang ², G.Q. Zhang ³, L.J. Ernst ² ¹ College of Aeronautics, University of Air Force Engineering, Xi?an, P.R.China ² Delft University of Technology, Delft, The Netherlands ³ Philips Semiconductors, Eindhoven; Delft University of Technology, Delft, The Netherlands
	Exact modelling of stress fields in multi-layer beams using readily available mathematics software Christopher Kinsella, Thomas D. Moore, John L. Jarvis, University of Limerick, Limerick, Ireland
	Moisture Effects on the Creep of Thermosetting IC Packaging Polymers Xiaosong Ma, K.M.B. Jansen, L.J. Ernst, TU Delft, The Netherlands

Session 12	10:00	Tuesday 17 Apr 2007
Multi-physics and thermal simulation and characterisation Marcel Meuwissen, TNO Science and Industry, Eindhoven, The Netherlands
	Design of High Performance Surface Transverse Wave Resonators Shuming T. Wang ¹, Mei-Hui Chung ¹, Chun-Hung Yu ² ¹ I-Shou University, Taiwan ² ftech Corporation, Taiwan
	SOI Die Heat Transfer Analysis from Device to Assembly Package Scott Irving, Yong Liu, Duane Connerny, Timwah Luk, Fairchild Semiconductor Corp., South Portland, ME, USA
	Numerical Examination and Experimental Verification of Thermal Performance of Board-level QFP with Unattached Drop-in Heat Spreader Yi-Shao Lai, Tong Hong Wang, Chang-Chi Lee, Hsuan-Yu Chen, Advanced Semiconductor Engineering, Inc., Nantze, Kaohsiung, Taiwan
	Compact Modeling of Diode with VHDL-AMS Including Reverse Recovery Lyse-Aline COYITANGIYE, Richard GRISEL, LEMI-Universit? de Rouen- IUT, Mont Saint Aignan, France
	Thermal Management of Bright LEDs for Automotive Applications Yan Lai, Nicolas Cordero, Tyndall National Institute, Cork, Ireland
	Multi-Physics Simulation Strategies with Application to Fuel Cell Modeling Brian H. Dennis ¹, Zhenxue Han ¹, Weiya Jin ¹, Bo Ping Wang ¹, Teppo Aapro ², Leon Xu ², Alexander Ptchelintsev ², Tommi Reinikainen ² ¹ University of Texas at Arlington ² Nokia Research Center
	Multi-domain and mixed-signal simulation of System-on-Chip embedding MEMS S. Basrour, K. Matou, Y. Ammar, M. Marzencki, A. Zenati, TIMA, Grenoble, France
	Modeling of the fabrication and operation of 3-D self assembled SOI MEMS C. M?ndez ¹, C. Louis ¹, S. Paquay ¹, P. De Vincenzo ¹, I. Klapka ¹, V. Rochus ², F. Iker ³, N. Andr ³, J.-P. Raskin ³ ¹ Open Engineering, Li?ge, Belgium ² Universit? de Li?ge, Li?ge, Belgium ³ Universit? catholique de Louvain, Louvain-la-Neuve, Belgium
	FEA Calculations for Ultra Thin Piezoresistive Pressure Sensor on SOI for Heatspreader Integration Bogdan Bercu, Laurent Mont, Panagiota Morfouli, Institute of Microelectronics, Electromagnetism and Photonics, Grenoble, France
	Finite Element Modeling of Electrostatic MEMS Including Fringing Field Effects Impacts on Forces M. Boutaayamou, K. H. Nair, R.V. Sabariego, P. Dular, Dept. of Electrical Engineering and Computer Science (ELAP), University of Li?ge, Li?ge, Belgium
	Interfacial Adhesion Method for Semiconductor Applications Covering the Full Mode Mixity J. Thijsse ¹, W.D. van Driel ², M.A.J. van Gils ², O. van der Sluis ³ ¹ Eindhoven University of Technology, Eindhoven, the Netherlands ² Philips Semiconductors, Nijmegen, the Netherlands ³ Philips Applied Technologies, Eindhoven, the Netherlands
	Measurements and FE-Simulations of Moisture Distribution in FR4 Based Printed Circuit Boards Fr?mont H?l?ne, IXL, Universit? Bordeaux 1 , Talence, France Horaud Walter, Solectron, Design & Technology Center, Bordeaux, France Weide-Zaage Kirsten, LFI, University of Hannover, Hannover, Germany
	An Analysis of Beam Deflections in Poly-SiGe Cantilevers Mario Gonzalez, Gregory Van Barel, Ann Witvrouw, Bart Vandevelde, IMEC, Leuven, Belgium
	A Monte Carlo investigation of nanocrystal memory reliability Riccardo Gusmeroli ¹, Alessandro S. Spinelli ¹, Christian Monzio Compagnoni ¹, Daniele Ielmini ¹, Andrea L. Lacaita ² ¹ DEI Politecnico di Milano - IU.NET, Milano, Italy ² DEI Politecnico di Milano - IU.NET, Milano, Italy and IFN-CNR, Milano, Italy
	Performance improvement of ballistic double-gate devices and design trade-offs Riccardo Gusmeroli, Alessandro S. Spinelli, DEI Politecnico di Milano - IU.NET, Milano, Italy
	Impact of source-drain tunneling on double-gate performance Alessandro S. Spinelli, Riccardo Gusmeroli, DEI Politecnico di Milano - IU.NET, Milano, Italy
	Analytic model of the deflection of piezoelectric unimorph and bimorph structures with numerical verification David Elata, Eyal Elka, Haim Abramovich, Technion - Israel Institute of Technology, Haifa, Israel
	Electro-migration Study in Solder Joint and Interconnects of IC packages L.H. Liang, Y.J. Xu, Y. Liu, Zhejiang University of Technology
	1 Gb stacked solution of multilevel NOR flash memory packaged in a LFBGA 8 mm by 10 mm by 1.4 mm of thickness Michele Dellutri ¹, Paolo Pulici ², Domenico Guarnaccia ¹, Pierpaolo Stoppino ¹, Gianpietro Vanalli ¹, Tito Lessio ¹, Francesco Vassallo ¹, Rosario Di Stefano ¹, Giuseppe Labriola ¹, Alberto Tenerello ¹, Filippo Lo Iacono ¹, Giovanni Campardo ¹ ¹ STMicroelectronics, Agrate Brianza (MI), Italy ² Politecnico di Milano, Department of electronics, Milano, Italy
	Thermo-Electric Simulation of a 77GHz Radar Transmitter Chip for Automotive Applications Adam Augustin, Torsten Hauck, Akbar Ghazinour, Freescale Semiconductor, Germany
	High Speed Pull Test Characterization for Pb-Free Ball Alloys into BGA Packages. Anna Tiziana Valota ¹, Aldo Losavio ¹, Loic Renard ¹, Antonello Vicenzo ² ¹ STMicroelectronics ² Politecnico di Milano
	MVT corrections for the evaluation of damping in MEMS Cercignani Carlo ¹, Frangi Attilio ¹, Lorenzani Silvia ¹, Vigna Benedetto ² ¹ Politecnico di Milano, Italy ² STMicroelectronics, Italy
	Multiphysics softwares benchmark on ANSYS/COMSOL applied for RF MEMS switches packaging simulations D. Peyrou ¹, P. Pons ¹, M. Saadaoui ¹, D. Leray ², A. Ferrand ², K. Yacine ¹, H. Granier ¹, A.Nicolas ³, J.W. Tao ⁴, R. Plana ¹ ¹ LAAS-CNRS, Toulouse, France ² INSA LGMT-COSAM, Toulouse, France ³ MEMSCAP, Crolles, France ⁴ ENSEEIHT-LEN7, Toulouse, France
	Hybrid Constant Temperature Regulator Reznicek Zdenek ¹, Tvarozek Vladimir ², Szendiuch Ivan ³, Reznicek Michal ³ ¹ HIT Ltd., Nedachlebice, Czech Republic ² Slovak University of Technology, Bratislava, Slovakia ³ Brno University of Technology, Brno, Czech Republic
	Electromechanical model of a multi-layer piezoelectric cantilever Jordi Brufau-Penella, Manel Puig-Vidal, Universitat de Barcelona, Spain
	Modeling and Simulation of Ferrite and Varistor EMI Suppressors Mirjana Damnjanovic, Goran Stojanovic, Ljiljana Zivanov, Faculty of Technical Sciences, University of Novi Sad, Serbia and Montenegro
	FEM modelling of piezo-actuated microswitches F.Chapuis ¹, F.Bastien ², J.F.Manceau ², F.Casset ³, P.L.Charvet ⁴ ¹ Institut FEMTO-ST, dept LPMO, Besan?on, France; STmicroelectronics, Crolles, France ² Institut FEMTO-ST, dept LPMO, Besan?on, France ³ CEA-LETI, Grenoble, France; STmicroelectronics, Crolles, France ⁴ CEA-LETI, Grenoble, France
	Effect of interfacial adhesion of copper/epoxy under different moisture level Edward K L Chan, Haibo Fan, Matthew M F Yuen, The Hong Kong University of Science and Technology
	FEM based design and simulation of bulk micromachined MEMS accelerometers with low cross-axis sensitivity R. Mukhiya ¹, A. Adami ², A. Bagolini ², M. Zen ², S. Kal ¹ ¹ Advanced Technology Centre / E & ECE Dept., IIT, Kharagpur, India ² Microsystems Division, ITC-irst, Trento, Italy
	Geometric Parameters Identification for Bulk-Micromachined Accelerometer from Modal Frequencies Measurements Steffen Michael, Melexis GmbH, Haarbergstra?e 67, D-99097 Erfurt, Germany Michael Katzschmann, IMMS gGmbH , Ehrenbergstr. 27, D-98693 Ilmenau, Germany Siegfried Hering, X-FAB Semiconductor Foundries AG, Haarbergstra?e 67, D-99097 Erfurt, Germany
	Shear Horizontal Surface Acoustic Wave Sensors Based on Polyaniline for Ammonia Gas Sensing Chi-Yen Shen, Cheng-Liang Hsu, De-Lu Wang, I- Shou University, Kaohsiung County, Taiwan
	Analysing the Performance of Flexible Substrates for Lead-Free Applications C. Y. Yin ¹, H. Lu ¹, C. Bailey ¹, Y. C. Chan ² ¹ University of Greenwich, London, United Kingdom ² City University of Hong Kong, Hong Kong, China
	Numerical simulation of SU-8 Optical Accelerometers A. Llobera ¹, V.J. Cadarso ¹, V. Seidemann ², S.B?ttgenbach ², J.A.Plaza ¹ ¹ Instituto de Microelectr?nica de Barcelona, Barcelona, Spain ² Institut f?r Mikrotechnik,Braunschweig, Germany

Session 13		11:00	Tuesday 17 Apr 2007
Prediction of Fatigue Failure S. Wiese, Dresden University of Technology, Germany; F. Gao, Osaka University, Japan
11:00	30mn	Fatigue and thermal fatigue damage analysis of thin metal films G. P. Zhang ¹, C. A. Volkert ², R. Schwaiger ², R. M?nig ³, O. Kraft ² ¹ Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, P. R. China ² Institut f?r Materialforschung II, Forschungszentrum Karlsruhe, Germany ³ Department of Materials Science and Engineering, Massachusetts Institute of Technology, USA
11:30	20mn	FATIGUE LIFE OF SOLDER BUMPS IN A SYSTEM IN PACKAGE: RELATING POWER CYCLING TO THERMAL CYCLING J.G.J. Beijer ¹, M.Y. Jansen ¹, G.M. Janssen ¹, J.A. Bielen ², E.P.A. Tijssen ² ¹ Philips Applied Technologies ² Philips Semiconductors
11:50	20mn	Power Amplifier (PA) Transistors Fatigue Life Prediction under Thermo-Mechanical Cyclic Loading Jianjun Wang, Weiqun Peng, Wei Ren, Nokia, Irving, USA
12:10	20mn	The Successive-Initiation Modeling Strategy for Modeling Damage Progression: Application to Voided Solder Interconnects Leila J. Ladani, Abhijit Dasgupta, CALCE Center, Mechanical Engg. Dept., University of Maryland, USA

Session 14		11:00	Tuesday 17 Apr 2007
Optimization based Design W. van Driel, Philips Semiconductors, The Netherlands; J. Auersperg, Fraunhofer Institute IZM, Germany
11:00	30mn	Combined Fracture, Delamination Risk and Fatigue Evaluation of Advanced Microelectronics Applications Towards RSM/DOE Concepts J?rgen Auersperg ¹, Rainer Dudek ², Bernd Michel ² ¹ Fraunhofer IZM, Berlin and AMIC Angewandte Micro-Messtechnik GmbH, Berlin ² Fraunhofer IZM, Berlin
11:30	20mn	Virtual Prototyping Based Design Optimization of the Substrate, Leadframe and Flip Chip Package Families with Low-k Technology W.D. van Driel ¹, A-M. Grech ², T. Hauck ³, I. Schmadlak ³, X. Zhang ², S. Orain ⁴ ¹ Philips Semiconductors ² STMicroelectronics ³ Freescale ⁴ Crolles Alliance
11:50	20mn	Sensitivity Design of Chip-in-Substrate-Package Using DOE with Factorial Analysis Technology Ming-Chih Yew ¹, Chang-Ann Yuan ¹, Yu-Hua Chen ², Wen-Kung Yang ³, Kuo-Ning Chiang ¹ ¹ National Tsing Hua University, HsinChu, Taiwan ² Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan ³ Advanced Chip Engineering Technology Inc.,Hsinchu, Taiwan
12:10	20mn	Probabilistic Analysis of the Influences of Design Parameter on the Reliability of Chip Scale Packages J?rgen Wilde, Elena Zukowski, University of Freiburg, Germany

Session 15		14:00	Tuesday 17 Apr 2007
Characterization and Modeling of Polymer Behavior N. Iwamoto, Honeywell, USA; K-N. Chiang, National Tsing Hua University, Taiwan
14:00	30mn	Effect of chemistry on viscoelastic properties of moulding compounds K.M.B. Jansen ¹, L.J. Ernst ¹, H.J.L. Bressers ² ¹ TU Delft, The Netherlands ² Philips Semiconductors Nijmegen, The Netherlands
14:30	20mn	Thermo-mechanical characterisation of a nano-sized particle filled underfill Marcel Meuwissen, Adri van der Waal, Irene Hovens, Corn? Rentrop, TNO Science and Industry, Eindhoven, The Netherlands
14:50	20mn	Design, Experiment and Analysis of the Solder on Rubber (SOR) structure of WLCSP Cadmus Yuan ¹, G. Q. Zhang ², Ching-Shun Huang ³, Chun-Hui Yu ⁴, Chin-Cheng Yang ⁵, Wen-Kung Yang ⁶, Ming-Chih Yew ⁷, Cheng Nan Han ⁷, Kou-Ning Chiang ⁸ ¹ PostDoc, Department of Precision and Microsystem Engineering, Delft University of Technology, The Netherlands ² Professor, Department of Precision and Microsystem Engineering, Delft University of Technology, The Netherlands ³ Engineer, Advanced Chip Engineering Technology Inc., Taiwan ⁴ Manager, Advanced Chip Engineering Technology Inc., Taiwan ⁵ Vice Managing Director, Advanced Chip Engineering Technology Inc., Taiwan ⁶ Managing Director, Advanced Chip Engineering Technology Inc., Taiwan ⁷ Research Assistant, Department of Power Mechanical Engineering, National Tsing Hua University ⁸ Professor, Department of Power Mechanical Engineering, National
15:10	20mn	Measuring in-thickness mechanical properties of sub micron polymer dielectric films. M. van Soestbergen ¹, L. J. Ernst ¹, K. M. B. Jansen ¹, W. D. van Driel ², M. Bartek ¹, A. Polyakov ¹ ¹ TU Delft, Delft, The Netherlands ² Philips Semiconductors, Nijmegen, The Netherlands

Session 16		14:00	Tuesday 17 Apr 2007
Solder Joint Life Prediction G-P. Zhang, Chinese Academy of Sciences, China; W. Dreyer, Weierstrass Institute for Applied Analysis and Stochastics, Germany
14:00	30mn	The correlation between the intermetallic compounds growth pattern and the addition in the solder matrix Feng Gao, Tadashi Takemoto, Joining and Welding Research Institute,Osaka University,Osaka,Japan
14:30	20mn	Updated Solder Joint Life Prediction Model Parameters after Eliminating Modeling Assumption and Sensitivity to Constitutive Equations Ahmer Syed, Amkor Technology, Inc.
14:50	20mn	Compositional Effects on the Creep Properties of SnAgCu Solder Steffen Wiese ¹, Frank Kr?mer ¹, Michael Krause ², Sandy Bennemann ², Maik M?ller ¹, Mike R?llig ¹, Matthias Petzold ², Klaus-J?rgen Wolter ¹ ¹ TU Dresden, IAVT ² Fraunhofer IWMH
15:10	20mn	Solder Joint Loading Conditions Under Torsion Test Wilson Carlos MAIA FILHO ¹, Michel BRIZOUX ², H?l?ne FREMONT ³, Yves DANTO ³ ¹ THALES Research & Technology France / IXL, ENSEIRB, Universit? de Bordeaux, France ² THALES Research & Technology, France ³ IXL, ENSEIRB, Universit? de Bordeaux, France
15:30	20mn	Reliability analysis of a new soldering process for automotive power modules application Mathieu Rizzi, Eric Woirgard, St?phane Azzopardi, IXL Laboratory ENSEIRB, Universit? de Bordeaux, France

Session 17		20:00	Tuesday 17 Apr 2007
AMICOM
20:00	20mn	EM Modeling of RF MEMS Larissa Vietzorreck, TU Muenchen, Germany
20:20	20mn	Acoustics of Piezoelectric devices Paul Kirby, Meiling Zhu, Cranfield University, United Kingdom
20:40	20mn	Modeling the electromechanical response of RF-MEMS switches David Elata, Technion - Israel Institute of Technology, Haifa, Israel

Session 18		08:30	Wednesday 18 Apr 2007
Keynote session: New Developments in Modeling and Experiments - 1 Y. Liu, Fairchild Semiconductors, USA; W. N?chter, Robert Bosch, Germany
08:30	30mn	Thermal Performance and Reliability of Thermal Interface Materials: A Review P. Rodgers ¹, V. Eveloy ¹, E. Rahim ², D. Morgan ² ¹ The Petroleum Institute, United Arab Emirates ² University of Maryland, College Park, USA
09:00	30mn	Numerical Simulation of Capillary and Fluid Dynamic Forces on Tiny Chips During Fluidic Self-Assembly Andrew A. O. Tay ¹, Hua Li ², Xiangyang Gao ¹, Jeremy Chen ¹, V. Kripesh ³ ¹ National University of Singapore, Singapore, Singapore ² Institute of High Performance Computing, Singapore, Singapore ³ Institute of Microelectronics, Singapore, Singapore
09:30	30mn	A Novel MEMS-based Nanoscale Material Testing System Horacio D. Espinosa ¹, Yong Zhu ¹, Alberto Corigliano ² ¹ Northwestern University ² Politecnico di Milano

Session 19		10:30	Wednesday 18 Apr 2007
Characterisation and Modeling of Interface Strength A. Tay, National University of Singapore, Singapore; H. Pape, Infineon Technologies, Germany
10:30	30mn	Adhesion and Fracture of Polymer-Metal Interfaces Jianmin Qu, Georgia Institute of Technology
11:00	20mn	Reliability Study of Interconnects Structure in IC Packages Yong Liu ¹, Yumin Liu ², Scott Irving ¹, Timwah Luk ¹, Don Desbiens ¹, Zhen Zhang ³, Zhigang Suo ³ ¹ Fairchild Semiconductor Corp. South Portland, ME, USA ² Fairchild Semiconductor, Suzhou, Jiangsu, China ³ Harvard University, Cambridge, MA, USA
11:20	20mn	Adhesion of Arbitrary-Shaped MEMS Microstructures Dhruv Bhate, Purdue University, West Lafayette, IN, USA Martin Dunn, University of Colorado, Boulder, CO, USA
11:40	20mn	Reliability issues in Cu/low-k structures regarding the initiation of stress-voiding or crack failure S. Orain ¹, A. Fuchsmann ², V. Fiori ², X. Federspiel ¹ ¹ Philips Semiconductors, Crolles, France ² STMicroelectronics, Crolles, France
12:00	20mn	Evolution of intermetallic phases in solder bonds Wolfgang Dreyer, Weierstrass Institute for Applied Analysis and Stochastics Berlin

Session 20		10:30	Wednesday 18 Apr 2007
Materials in Micro and Nanotechnologies Dr. Moshfegh Ramin, IVF, Sweden; Marcel Meuwissen, TNO, The Netherlands
10:30	30mn	Reliability in MEMS Ingrid De Wolf, IMECvzw, Leuven, Belgium
11:00	20mn	Characterization of Free-standing Thin Film Material Properties for RF-MEMS Vincent Burg ¹, Jaap den Toonder ¹, Auke van Dijken ², Johan Hoefnagels ³, Marc Geers ³ ¹ Philips Research Laboratories Eindhoven, The Netherlands / Eindhoven University of Technology, The Netherlands ² Philips Research Laboratories Eindhoven, The Netherlands ³ Eindhoven University of Technology, The Netherlands
11:20	20mn	APPLICATION OF AN INNOVATIVE TESTING METHOD FOR THE FATIGUE CHARACTERISATION OF 15 um THICK EPITAXIAL POLYSILICON Eleonora Ferraris ¹, Irene Fassi ¹, Marco Del Sarto ² ¹ ITIA-CNR, Milano, Italia ² STMicroelectronics, Cornaredo (MI), Italia
11:40	20mn	Prediction of Material Properties of Epoxy Using Molecular Dynamic Simulation Haibo Fan, Cell K.Y. Wong, Matthew M.F. Yuen, Department of Mechanical Engineering,Hong Kong University of Science and Technology,Clear Water Bay, Kowloon, Hong Kong
12:00	20mn	Microstructural Considerations for Ultrafine Lead Free Solder Joints Zhiheng Huang, Paul P. Conway, Rachel C. Thomson, Loughborough University, Loughborough, United-Kingdom

Session 21		14:00	Wednesday 18 Apr 2007
Keynote session: New Developments in Modeling and Experiments - 2 J. Qu, Georgia Tech, USA, B. Vandevelde, IMEC, Belgium
14:00	30mn	Molecular Modeling of Analyte Adsorption on MEMS GC Stationary Phases Nancy Iwamoto, Ulrich Bonne, Honeywell Laboratories (Specialty Materials and Automation and Control Solutions), USA
14:30	30mn	Multi-Energy Domain Modeling of Microdevices:Virtual Prototyping by Predictive Simulation Gerhard Wachutka, Institute for Physics of Electrotechnology, Munich University of Technology, Germany
15:00	30mn	From power smd to e-pad packages : a thermal bargain ? Claudio M. Villa, Arianna Morelli, Donata Gualandris, ST Microelectronics
15:30	30mn	Facing the challenge of designing for Cu/Low-K reliability W.D. van Driel, Delft University of Technology & Philips Semiconductors, The Netherlands

Go to Global conference schedule List of Technical Sessions Technical program List of sessions by Authors

Authors: find your session number:

Aapro : 12 Abramovich : 12 Abu-Salih : 4 Adami : 12 Aldo : 7 Ammar : 12 Andr : 12 Anttonen : 11 Arslan : 5 Attilio : 7 12 Auersperg : 14 Augustin : 12 Azzopardi : 16
BRIZOUX : 16 Bagdahn : 6 9 11 Bagolini : 12 Bailey : 12 Barel : 12 Bartek : 11 15 Basrour : 12 Beghi : 11 Beijer : 13 Benedetto : 12 Bennemann : 16 Bercu : 12 Bhate : 3 19 Bielen : 3 13 Bonnaud : 6 Bonne : 21 Boutaayamou : 12 Bragin : 11 Bressers : 15 Brufau-Penella : 12 Burg : 20
COYITANGIYE : 12 Cacchione : 9 Cadarso : 12 Campardo : 12 Carles : 5 Carlo : 7 12 Cejtchaml : 11 Chan : 3 12 Charvet : 12 Chen : 5 12 14 18 Cheng : 11 Chiang : 11 14 15 Chini : 7 Chiu : 11 Chou : 11 Chung : 12 Clerici : 11 Codreanu : 5 Cognetti : 1 Compagnoni : 12 Connerny : 12 Conway : 20 Cordero : 12 Corigliano : 9 18
D?planque : 11 D?ring : 8 DANTO : 16 Dalton : 2 Damnjanovic : 12 Dasgupta : 2 13 Davoine : 11 Dellutri : 12 Dennis : 12 Desbiens : 8 19 Dijken : 20 Doetzel : 10 Dreyer : 19 Driel : 3 8 11 12 14 15 21 Du?ek : 11 Dudek : 8 14 Dular : 12 Dunn : 19 Duysinx : 4
Eason : 2 Ebert : 6 9 11 Elata : 3 4 12 17 Elisabetta : 11 Elka : 12 Engelen : 3 Enright : 2 Ernst : 11 15 Espinosa : 18 Eveloy : 18
FILHO : 16 FREMONT : 16 Falat : 11 Fan : 12 20 Fassi : 20 Federspiel : 19 Fendler : 11 Ferrand : 12 Ferraris : 20 Ferruccio : 11 Fiori : 19 Fortunier : 11 Francesco : 11 Frangi : 9 Fuchsmann : 19
GALVEZ : 5 GODIGNON : 5 GRISEL : 12 Gaddi : 10 Gao : 16 18 Geers : 20 Gerbach : 9 Gessner : 10 Ghazinour : 12 Gils : 3 12 Godignon : 5 Golinval : 4 Gommans : 3 Gonzalez : 11 12 Graef : 1 Granier : 12 Grech : 14 Greiner : 10 Gualandris : 21 Guarnaccia : 12 Gudmundson : 6 Gusmeroli : 12
H?l?ne : 12 Han : 12 15 Hauck : 6 12 14 He : 11 Hedler : 8 Heino : 11 Hering : 9 12 Hirshberg : 3 Hochstenbach : 11 Hodes : 2 Hoefnagels : 20 Hovens : 15 Hsu : 12 Huang : 11 15 20
Iacono : 12 Ielmini : 12 Iker : 12 Irving : 8 12 19 Ivan : 12 Iwamoto : 21
JORDA : 5 Jakubka : 11 Jansen : 11 13 15 Janssen : 8 13 Jarvis : 11 Jerome : 7 Jin : 12 Jord : 5
Kal : 12 Kangasvieri : 11 Katzschmann : 12 Kinsella : 11 Kirby : 17 Kirsten : 12 Klapka : 12 Knoll : 6 Kolbe : 11 Kolchuzhin : 10 Kolodner : 2 Korvink : 10 Kr?mer : 16 Kraft : 13 Krause : 16 Kripesh : 18 Krupenkin : 2 Ku : 11
Labriola : 12 Lacaita : 12 Ladani : 13 Lahoti : 6 Lai : 6 12 Lee : 12 Lehtiniemi : 5 Lemaire : 4 Leo : 11 Leray : 12 Lessio : 12 Li : 6 11 18 Liang : 12 Limaye : 11 Lishchynska : 4 Liu : 8 12 19 Llobera : 12 Losavio : 12 Louis : 11 12 Lu : 12 Luk : 8 12 19
M?ller : 16 M?ndez : 12 M?nig : 13 MADRID : 5 MILLAN : 5 Ma : 11 Manceau : 12 Marco : 5 Marzencki : 12 Matou : 12 McNeill : 6 Mehner : 10 Meuwissen : 15 Meyer : 8 Meyyappan : 1 Michael : 9 12 Michal : 12 Michel : 8 11 14 Mijalkovic : 10 Mill : 5 Mont : 12 Moore : 11 Morelli : 21 Morfouli : 12 Morgan : 18 Mukhiya : 12
N?chter : 11 Nair : 12 Noritake : 11 Nousiainen : 11
O'Mahony : 4 Obreja : 5 Orain : 14 19 Ortiz : 7
Palac : 5 Pandolfi : 7 Paquay : 12 Peng : 11 13 Petzold : 16 Peyrou : 12 Plana : 12 Plaza : 12 Polyakov : 11 15 Pons : 12 Ptchelintsev : 11 12 Puig-Vidal : 12 Pulici : 12 Putaala : 11
Qian : 8 Qu : 19
R?llig : 11 16 Rahim : 18 Raskin : 12 Reinikainen : 12 Ren : 9 13 Renard : 12 Rencz : 4 Rentrop : 15 Resta : 11 Richardson : 4 Rixen : 4 Rizzi : 16 Rochus : 4 12 Rodgers : 18 Roosmalen : 1 Rudnyi : 10
Saadaoui : 12 Sabariego : 12 Sacco : 7 Salleras : 5 Sarto : 20 Sch?nfelder : 11 Schacht : 11 Schmadlak : 14 Schwaiger : 13 Seidemann : 12 Sharan : 6 Shen : 12 Signoriello : 11 Silfhout : 3 8 Silvia : 7 12 Slattery : 4 Sluis : 3 8 12 Soestbergen : 15 Spinelli : 12 Spinola : 11 Stefano : 12 Stojanovic : 12 Stoppino : 12 Subbarayan : 3 Suo : 19 Syed : 16 Szendiuch : 11
Takemoto : 16 Tao : 12 Tay : 3 18 Tenerello : 12 Theunis : 3 Thijsse : 12 Thomson : 20 Tijssen : 13 Tin : 10 Toonder : 20
Urb?nek : 11
V?h?kangas : 11 VELLVEHI : 5 Valota : 12 Valtanen : 11 Vanalli : 12 Vandevelde : 5 11 12 Vassallo : 12 Vellvehi : 5 Vicenzo : 12 Vietzorreck : 17 Vigna : 2 Villa : 21 Vincenzo : 12 Vladimir : 12 Volkert : 13 Vries : 11
Waal : 15 Wachutka : 21 Walter : 8 12 Wang : 9 11 12 13 Wiese : 11 16 Wilde : 14 Wittler : 4 Witvrouw : 12 Woirgard : 16 Wolf : 20 Wolter : 11 16 Wong : 20 Wu : 11 Wunderle : 11 Wymyslowski : 11
Xu : 12
Yacine : 12 Yang : 11 14 15 Yeh : 6 Yew : 11 14 15 Yin : 12 Yu : 11 12 15 Yuan : 11 14 15 Yuen : 12 20
Zapf : 8 Zdenek : 12 Zen : 12 Zenati : 12 Zerbini : 9 Zhang : 1 8 11 13 14 15 19 Zhou : 6 11 Zhu : 17 18 Zivanov : 12 Zukowski : 14

Sat, 14 Oct 2006 16:19:31 +0200

End of programme